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| HCC4076B HCF4076B 4 BIT D TYPE REGISTERS .THREESTATEOUTPUTS .I .GATEDOUTPUTCONTROLLI .QUI .5V,10VAND15VPARAMETRI .I .100%TESTEDFORQUI .MEETSALLREQUI NPUT DISABLE WITHOUT GATING THE CLOCK NES FOR ENABLING OR DISABLING THE OUTPUTS ESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE C RATINGS o NPUT CURRENT OF 100nA AT 18V AND 25 C FOR HCC DEVICE ESCENT CURRENT REMENTS OF JEDEC TENTATIVE STANDARD N. 13A, " STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES " EY (Plastic Package) F (Ceramic Package) M1 (Micro Package) C1 (Chip Carrier) ORDER CODES : HCC4076BF HCF4076BM1 HCF4076BEY HCF4076BC1 PIN CONNECTIONS DESCRIPTION The HCC4076B (extended temperature range) and HCC4076B (intermediate temperature range) are monolithic integrated circuit, available in 16 lead dual in line plastic or ceramic package and plastic micropackage. The HCC/HCF4076B types are four-bit registers consisting of D-type flip-flops that feature threestate outputs. Data Disable inputs are provided to control the entry of data into theflip-flops. When both Data Disable inputs are low, data at the D inputs are loaded into their respective flip-flops on the next positive transition of the click input. Output Disable inputs are also provided. When the Output Disable inputs are both low, the normal logic states of the four outputs are available to the load. The outputs are disabled independently of the clock by a high logic level at either Output Disable input, and present a high impedance. September 1988 1/13 HCC/HCF4076B FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATING Symbol VDD * Vi II Ptot Parameter Supply Voltage: HCC Types HCF Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range Operating Temperature: HCC Types HCF Types Storage Temperature Value -0.5 to +20 -0.5 to +18 -0.5 to VDD + 0.5 10 200 100 -55 to +125 -40 to +85 -65 to +150 Unit V V V mA mW mW o o o Top Tstg C C C Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress ratingonly and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol VDD VI Top Parameter Supply Voltage: HCC Types HCF Types Input Voltage Operating Temperature: HCC Types HCF Types Value 3 to 18 3 to 15 0 to VDD -55 to +125 -40 to +85 Unit V V V o o C C 2/13 HCC/HCF4076B LOGIC DIAGRAM TRUTH TABLE RESET 1 0 0 0 0 0 0 0 1 CLOCK X 0 DATA INPUT DISABLE G1 G2 X X 1 X 0 0 X X X X X 1 0 0 X X DATA D X X X X 1 0 X X NEXT STATE OUTPUT G 0 Q Q Q 1 0 Q Q NC NC NC NC NC When either Output DisableM or Nis high, theoutputs aredisablesd (high impedance state): however sequential operation of the flip-flopisnot affected. 1 = High Level, 0 = Low Level, X = Don't Care, NC = No Change 3/13 HCC/HCF4076B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditios Symbol IL Parameter Quiescent Current VI (V) 0/5 HCC Types 0/10 0/15 0/20 HCF Types V OH Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Output Drive Current 0/5 HCC Types 0/5 0/10 0/15 0/5 HCF Types 0/5 0/10 0/15 IOL Output Sink Current HCC Types HCF Types IIH, IIL IOH, IOL Input Leakage Current Input Leakage Current HCC Types HCF Types 0/5 0/10 0/15 0/5 0/10 0/15 0/18 0/15 0/18 0/15 0/5 0/10 0/15 0/5 0/10 0/15 5/0 10/0 15/0 VIH 0.5/4.5 1/9 1.5/13.5 4.5/0.5 9/1 13.5/1.5 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 Any Input 0/18 0/15 Any Input <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 VO (V) |IO| VDD (A) (V) 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 15 18 15 -2 -0.64 -1.6 -4.2 -1.53 -0.52 -1.3 -3.6 0.64 1.6 4.2 0.61 1. 3.6 0.1 0.3 0.4 1.0 3.5 7 11 1.5 3 4 -1.6 -0.51 -1.3 -3.4 -1.36 -0.44 -1.1 -3.0 0.51 1.3 3.4 0.44 1.1 3.0 -3.2 -1 -2.6 -6.8 -3.2 -1 -2.6 -6.8 1 2.6 6.8 1 2.6 6.8 10-5 10-5 10-4 10-4 5 0.1 0.3 0.4 1.0 7.5 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -1.15 -0.36 -0.9 -2.4 -1.1 -0.36 -0.9 -2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 1 12 7.5 A A A A pF mA mA TLOW * Min. Max. 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 V V Value 25 oC Min. Typ. Max. 0.04 0.04 0.04 0.08 0.04 0.04 0.04 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 V V THIGH * Min. Max. 150 300 600 3000 150 300 600 A Unit VOL V IL IOH CI Input Capacitance * TLOW = -55 oC for HCC device: -40 oC for HCF device. * THIGH = +125 oC for HCC device: +85 oC for HCF device. The Noise Margin for both "1" and "0" level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. with VDD = 15 V 4/13 HCC/HCF4076B DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 o C, C L = 50 pF, RL = 200 K, o typical temperature coefficent for all VDD values is 03 %/ C, all input rise and fall times= 20 ns) Symbol tPLH tPHL tPHL(R) Parameter Propagation Delay Time (Clock to Q Output) Propagation Delay Time (Reset) 3-State Output 1 or 0 to High Impedance Test Conditions VDD (V) 5 10 15 5 10 15 RL = 1K 5 10 15 RL = 1K 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 Min. Value Typ. 300 125 90 230 100 75 150 75 60 150 75 60 100 50 40 60 25 20 100 40 30 90 50 35 6 12 16 Max. 600 250 180 460 200 150 300 150 120 300 150 120 Unit ns ns tP(1-H) tP(0-H) tP(H-1) tP(L-1) tW ns 3-State High Impedance to 1 or 0 Output ns Clock Pulse Width tW Reset Pulse Width tsetup Data Setup Time tsetup Data Input Disable Setup Time fmax Maximum Clock Frequency tr, tf Clock Input Rise or Fall Time 200 100 80 120 50 40 200 80 60 180 100 70 3 6 8 15 5 5 ns ns ns ns MHz s 5/13 HCC/HCF4076B Typical Output Low (sink) Current Characteristics Minimum Output Low (sink) Current Characteristics Typical Output High (source) Current Characteristics Minimum Output High (source) Current Characteristics Typical Maximum Clock Input Frequency vs Supply Voltage Typical Dynamic Power Dissipation vs Frequency 6/13 HCC/HCF4076B Typical Propagation Delay Time vs Capacitance Typical Transition Time vs Load Capacitance WAVEFORMS 7/13 HCC/HCF4076B TEST CIRCUITS Quiescent Device Current. Noise Immunity. Input Leakage Current. 8/13 HCC/HCF4076B Plastic DIP16 (0.25) MECHANICAL DATA mm MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 inch TYP. MAX. DIM. P001C 9/13 HCC/HCF4076B Ceramic DIP16/1 MECHANICAL DATA mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 0.51 0.38 17.78 2.79 0.55 1.52 0.31 1.27 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.020 3.3 0.015 0.700 0.110 0.022 0.060 0.012 0.050 0.406 0.317 0.200 TYP. MAX. 20 7 0.130 MIN. inch TYP. MAX. 0.787 0.276 DIM. P053D 10/13 HCC/HCF4076B SO16 (Narrow) MECHANICAL DATA DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 9.8 5.8 1.27 8.89 4.0 5.3 1.27 0.62 8 (max.) 0.149 0.181 0.019 10 6.2 0.35 0.19 0.5 45 (typ.) 0.385 0.228 0.050 0.350 0.157 0.208 0.050 0.024 0.393 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.004 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010 P013H 11/13 HCC/HCF4076B PLCC20 MECHANICAL DATA mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180 DIM. P027A 12/13 HCC/HCF4076B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13 |
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